Variability of the local φMS values over the gate area of MOS devices

Authors

  • Henryk M. Przewłocki Institute of Electron Technology, Poland
  • Andrzej Kudła Institute of Electron Technology, Poland
  • Danuta Brzezińska Institute of Electron Technology, Poland
  • Hisham Z. Massoud Duke University image/svg+xml

DOI:

https://doi.org/10.26636/jtit.2005.1.294

Keywords:

MOS structure, photoelectric measurements, electrical parameters, mechanical stress

Abstract

The local value distributions of the effective contact potential difference (ECPD or the φMS factor) over the gate area of Al-SiO2-Si structures were investigated for the first time. A~modification of the photoelectric φMS measurement method was developed, which allows determination of local values of this parameter in different parts of metal-oxide-semiconductor (MOS) structures. It was found that the φMS distribution was such, that its values were highest far away from the gate edge regions (e.g., in the middle of a square gate), lower in the vicinity of gate edges and still lower in the vicinity of gate corners. These results were confirmed by several independent photoelectric and electrical measurement methods. A model is proposed of this distribution in which the experimentally determined φMS distributions, found previously, are attributed to mechanical stress distributions in MOS structures. Model equations are derived and used to calculate φMS distributions for various structures. Results of these calculations remain in agreement with experimentally obtained distributions. Comparison of various characteristics calculated using the model with the results of photoelectric and electrical measurements of a wide range of Al-SiO2-Si structures support the validity of the model.

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References

[1] C. H. Bjorkman, J. T. Fitch, and G. Lucovsky, „Correlation between midgap interface state density and thickness-averaged oxide stress and strain at SiO2 interfaces formed by thermal oxidation of Si”, Appl. Phys. Lett., vol. 56, pp. 1983-1985, 1990.
View in Google Scholar

[2] S. M. Hu, „Stress related problems in silicon technology”, J. Appl. Phys., vol. 70, pp. R53-R80, 1991.
View in Google Scholar

[3] H. M. Przewłocki and H. Z. Massoud, „The effects of stress annealing in nitrogen on the effective contact potential difference (ECPD), charges and traps at the Si/SiO2 interface of MOS devices”, J. Appl. Phys., vol. 92, pp. 2198-2201, 2002.
View in Google Scholar

[4] I. De Wolf, H. E. Maes, and S. K. Jones, „Stress measurements in silicon devices through Raman spectroscopy: bridging the gap between theory and experiment”, J. Appl. Phys., vol. 79, pp. 7148-7156, 1996.
View in Google Scholar

[5] K. F. Dombrowski, I. De Wolf, and B. Dietrich, „Stress measurements using ultraviolet micro-Raman spectroscopy”, Appl. Phys. Lett., vol. 75, pp. 2450-2451, 1999.
View in Google Scholar

[6] H. M. Przewłocki, „Theory and applications of internal photoemission in the MOS system at low electric fields”, Sol. St. Electron., vol. 45, pp. 1241-1250, 2001.
View in Google Scholar

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Submitted

2023-04-09

Published

2005-03-30

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Section

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How to Cite

[1]
H. M. Przewłocki, A. Kudła, D. Brzezińska, and H. Z. Massoud, “Variability of the local φMS values over the gate area of MOS devices”, JTIT, vol. 19, no. 1, pp. 34–40, Mar. 2005, doi: 10.26636/jtit.2005.1.294.

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