Oxidation kinetics of silicon strained by silicon germanium

Authors

  • Jarosław Grabowski
  • Romuald B. Beck

DOI:

https://doi.org/10.26636/jtit.2007.3.824

Keywords:

oxidation, kinetics, modeling, silicon, silicon germanium

Abstract

This paper reports on the studies of oxidation kinetics of silicon strained by silicon germanium layers. Experimental results of natural, chemical and thermal oxide formation are presented. The oxidation rates of silicon strained by SiGe layers have been compared with the rates of pure Si oxidation. The oxidation kinetics was studied using the parallel model proposed by Beck and Majkusiak. This model was fitted with good result to the obtained experimental data and the parameter that is most probably responsible for the strain effect was identified, as well as its dependence on Ge content in the SiGe layer.

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Published

2007-09-30

Issue

Section

ARTICLES FROM THIS ISSUE

How to Cite

[1]
J. Grabowski and R. B. Beck, “Oxidation kinetics of silicon strained by silicon germanium”, JTIT, vol. 29, no. 3, pp. 30–32, Sep. 2007, doi: 10.26636/jtit.2007.3.824.