Oxidation kinetics of silicon strained by silicon germanium
DOI:
https://doi.org/10.26636/jtit.2007.3.824Keywords:
oxidation, kinetics, modeling, silicon, silicon germaniumAbstract
This paper reports on the studies of oxidation kinetics of silicon strained by silicon germanium layers. Experimental results of natural, chemical and thermal oxide formation are presented. The oxidation rates of silicon strained by SiGe layers have been compared with the rates of pure Si oxidation. The oxidation kinetics was studied using the parallel model proposed by Beck and Majkusiak. This model was fitted with good result to the obtained experimental data and the parameter that is most probably responsible for the strain effect was identified, as well as its dependence on Ge content in the SiGe layer.
Downloads
Downloads
Published
Issue
Section
License
Copyright (c) 2023 Journal of Telecommunications and Information Technology

This work is licensed under a Creative Commons Attribution 4.0 International License.