GŁUSZKO, Grzegorz; ŁUKASIAK, Lidia; KILCHYTSKA, Valeriya; MING CHUNG, Tsung; OLBRECHTS, Benoit; FLANDRE, Denis; RASKIN, Jean-Pierre. Charge-pumping characterization of SOI devices fabricated by means of wafer bonding over pre-patterned cavities. Journal of Telecommunications and Information Technology, Warsaw, Poland, v. 29, n. 3, p. 61–66, 2007. DOI: 10.26636/jtit.2007.3.831. Disponível em: https://www.jtit.pl/jtit/article/view/831. Acesso em: 10 jun. 2026.